I have got a FC10. It is a really nice case but I’m a little worried about the heatpipes solution. I’m planing to use an Asus P8H77-M.
The FC10 comes with 4 heatpipes. They are flat worked at both ends. This flat surface is uneven. I suppose, seeing the surface closely, that they achieved this by hammering the pipes at it ends.
Heatpipes 687k .jpg file
Streacom tested the new flat pipes system, sure, but I don't understand why they had leave the old cool-solution/concept (no EVO line, etc) that provides a CPU cooler block with solid mount on round pipes.
This is not my first system. There are dozen of articles teaching you how to apply the appropriate amount of thermal paste. I always read, that for a good thermal transition between metals, you need to apply as less as possible TIM. The objective is to fill the “minimal” gaps and achieve a closely contact between the CPU and the cooler-block or flat/direct contact pipes.
The new Streacom’s models (FC9, 10 and the Evo line having pipes with “flat” ends) have got really big gaps between the surfaces, in my opinion. I could be wrong, but I would feel saver if I have got round pipes and a firmly attachment at both ends (the old model's solution). The pipes fit “loosely” on the CPU cooler block. And while the flat pipe’s surface is uneven, producing gaps between both surfaces, you need to apply really an insane amount of TIM on the pipes. This is a mess.
Heatpipes and CPU block 604k .jpg file
Another concerning point in my build is that one pipe touches a motherboard’s capacitor. It is not possible to bend a little the pipe, because the are flat and I risk to make a kink or break it. For this problem Streacom provides the ST-HT4 Heatpipe Adapter. This adapter have got flat pipes too, and again, more new gaps to fill with tones of TIM.
I'm considering to use an alternative cooling solution. I don’t understand why Streacom leaves the old concept. There are flexible heatpipes, that would allow custom adaptations on a case that is said to support all motherboards types.