E5130 is not 65W .. it's TDP is 65W
Thermal Design Power (TDP) is the average maximum power a processor can dissipate
Maximum power dissipation is the maximum power dissipated by the CPU (or Minimum Power Dissipation : low power mode)
I3/E3 uses UDIMM ECC which less power consumption than RDIMM ECC (or E5).
FB-DIMM is the most power consumption. totally agree, as I read many spec... 7-10Watt differences comparing with DDR2 RDIMM ECC ( AMD solution at that time)
how many power consumption for RAM? you need to lookup RAM Spec on each vendors .
you can not compare 65nm with ehem 32nm or 11nm (current Intel x86 processor).
you need to see technologies on current trend:
1) C1E ( can halt/minimize cpu clock only where no activity in general speaking)
2) GV1/GV3 , Intel speedstep( can clock down and up)
* C1E and GV1/GV3 can be controlled by Hardware only
- 45nm consume less power than 65nm
*C3 and C6 can be controlled by OS/software
*C3/C6 would help minimize power consumption where controlled by OS/software
if you need to compare, try to compare with dual processor motherboard (E5) where the motherboard consume more power than single processor motherboard
but... E5 will blow away AIC server
E5 system will consume less power than 5XXX for sure.
the other consideration: add-on cards consume power too...
for ~300, you have a complete server... comparing than building/buy new E3 or E5 complete server.... you can decide.
check on AIC server that C1E and GV1/GV3 are enabled to reduced power usage